HIGH SPEED PCB DESIGN COURSE.

 HiGh-Speed PCB Design Course

Course Preamble:

Emergence of India as a global economy has opened up a huge demand for electronic products. National Policy on Electronics and Make in India initiative of Government of India has resulted in setting up of many industries in the Electronics sector and has led to a huge demand for trained man power in Electronics Board Design.

Course Objective:

Certificate Course on Electronics Board design and Bring up is offered to bridge the major gap in competencies required to design state-of-the art PCB and electronics products.

Course Outcome:

On successful completion of the Course, the Participants shall be able to

• Analyze customer requirement and interpreting user needs.
• Verify to check if design is feasible to develop within the framework of the specification
• Able to make an efficient Chip design which give the best performance, uses optimal power and in minimal area.

Course Structure:

This course consist of four modules. The modules are as follows:

Module 1: Electronics Board Design Basics  (1 Week )

Module 2:  Multilayer PCB Design(1 Week) 

Module 3: Introduction to High Speed Signaling (2 Week) 

Module 4: Semiconductor Packages (1 Week)

Course Contents

Module 1:  Electronics Board Design Basics (1 Week)

Evolution  and  Classification  of Printed Circuit Boards, Challenges in Modern PCB, Design and Manufacturing, PCB fabrication, methodologies(SSB, DSB and multilayer board), PCB design  considerations/ design rules for analog, digital and power applications,  Electromagnetic interference in electronic systems and its impact  Analysis of electronic circuit from noise emission point of view (both  conducted and radiated emission) cross talk and reflection behavior of  the circuit in time domain, Thermal management of electronic devices  and systems.

Module 2: Multilayer PCB Design (2 Week)

Multilayer PCB design guide lines, Design of Multilayer PCB Stack-up, Differential pair routing, Length matching, Generation of different types of reports.

Module 3: Introduction to High Speed Signaling (2 Week)

Introduction to high speed PCB design, Signal Integrity, Power Integrity and Thermal Analysis, Power distribution and noise, Signaling convention, termination, impedance matching & controlling, Timing Vision & Length Matching, Fanout under CPU, Planning Layout, Floor Planning, DDR3 preliminary layout, Crosstalk Calculation & Minimizing, Impedances & Stack-up, Back-Drilling of Via, High Speed Design Rules & Routing, Layer ordering & deciding, Length matching, About memory routing, Different types of Topologies & Interfaces and more in depth knowledge about HDI, High Speed Designs.

Module 4: Semiconductor Packages (1 Week)

Single chip packages or modules. (SCM)  Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM) - types; System-in package (SIP); Packaging roadmaps; Hybrid circuits.

This course covers all the important subjects you need to know for Advanced & High Speed Design as well as HDI PCB Layout:

• Placement (how to place CPU, memories, power supplies, connectors, protection, etc.)

• Basic Rules & Basic Stack-up (initial rules and stack-up settings to start your layout)

• Fanout under CPU (how to do placement and fanout in high-density areas)

• DDR3 preliminary layout (deciding on how to use layers, pin & bank swapping, … )

• Board fanout (how to do fanout, good practice and recommendations)

• Planning Layout (how to plan layout for high speed interfaces, wide buses, power distribution.

• Crosstalk (how to calculate and minimize crosstalk)

• Impedances & Stack-up (how to calculate impedance and decide on stack-up)

• High Speed Design Rules & Routing (recommendations & examples for high speed design layout)

• Layer ordering (how to decide on layer ordering)

• Number of layers (how to decide on number of layers)

• Layout (recommendations on routing different peripherals & buses, Powers...

• Length matching (DDR2/3, PCIE, HMDI, LVDS, GbE, USB, SATA, CAN BUS, ETHERNET ETC..)

• About memory routing (T-branch vs Fly-by topology, calibration)

• Polygons & Power Planes (how to work with polygons & planes, what is important, useful rules...)

• Checking PCB (recommendations for checking your PCB)

• Length tuning (differential pair length tuning, finishing memory layout, … )

• Finishing PCB (adding useful information e.g. manufacturing notes, mechanical drawing layer)

• Generating & Checking Gerber files (how to generate gerber files, tips about how to check them)

Course Fees: Call Us for your requirement & Needs on High-Speed Designs.

Eligibility

B.E./B.Tech in Electronics/ Electronics & Communication/ Electrical/ Electrical and Electronics/Instrumentation/ Biomedical /Computer Science/Information Technology or MSc in Electronics/ Instrumentation/ Computer Science/Information Technology or Diploma in Electronics/CS/IT/EEE/EI.

More Details

For more details please get in touch with us vtechlabs6@gmail.com 

For more Information please feel free to contact. (+91-8310774584)